Micro Laser Soldering
Traditionally, two similar or dissimilar wires were joined by either welding them (melting together) or soldering them (applying a metal with a lower melting point).
Medical devices inserted into the body via minimally invasive procedures, catheters, and permanent or temporary implants—are undergoing a continuous process of miniaturization. The purpose of this miniaturization is to reach otherwise inaccessible regions in the body, minimize disruption of regular bodily functions, reduce energy consumption, and increase device lifespan. As the physical size of modern devices diminishes, designers face an ever-growing challenge of connecting internal components to each other and to their operating systems.
With this challenge in mind, Benatav identified the need to develop production techniques for connecting components made of ultra-fine insulated wires to each other, or to thicker wires, without the use of any terminals. To address this need, Benatav developed a fine wire connectivity technology. This technology enables the connection of ultra-fine insulated wires of any serially manufactured diameter (down to 0.009 mm = 9 microns, or 59 AWG) to other ultra-fine wires or to wires up to five times as thick. These thermo-pressure connections provide highly reliable, corrosion-free, and strain-free connectivity without any soldering. Moreover, the fine wire connectivity technology enables fast and effective control of the production process, without erosion or aging of the materials, or undesirable deformations in the vicinity of the connections.
The unique advantages this technology offers include: