Fine Wire Connectivity Solutions

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Medical devices inserted into the body – via minimally invasive procedures, catheters, and permanent or temporary implants – are undergoing a continuous process of miniaturization, with the purpose of reaching otherwise inaccessible regions in the body, minimizing disruption of regular body functioning, minimizing energy consumption, and increasing device lifetime. As the physical size of modern devices is reduced, the designer is faced with an ever growing challenge of connecting its internal components to each other and to their operating systems.

With this challenge in mind, Benatav identified the need for developing production techniques for connecting components made of ultra-fine insulated wires to each other, or to thicker wires, without any terminals. To meet this need, Benatav developed a fine wire connectivity technology that enables connecting ultra-fine insulated wires at any serially manufactured diamete (down to 0.009 mm = 9 microns, or 59 AWG) to other ultra-fine wires or to wires up to 5 times as thick. These thermo-pressure connections provide highly reliable, corrosion-free, and strain-free connectivity without any soldering. Moreover, the fine wire connectivity technology enables fast and effective control of the production process, without erosion or aging of the materials, or undesirable deformations in the vicinity of the connections.

The unique advantages this technology offers include:

  • Reduced noise level
  • Connection strain relief
  • Safer production process: no risk of damaging sensitive areas during consecutive production stages
  • Highly reliable connection: no oxidization, no erosion